Precise BGA Rework Tools

Description:15 in 1 Guide Magnetic Screw Keeper Memory Chart Mat Figure Positioning Pad Repair Tool for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XRR/11/11 PRO/11 PRO MAXSpecification:Quantity: 15 Sheets/SetProduct Size: 177 X 160 X 6mm/6.97 X 6.3 X 0.24"Compatible Models: for iPhone 6 / 6P / 6S / 6S..

Features:Function: Reballing IC pins. Suitable for iPhone 6/6P 7/7P 8/8P XS.Package Included:1 x Tin Planting Net for iPhone 6/6P 7/7P 8/8P XSDetail Picures:..

Features:Applicable: 5 CPU models: A8/A9/A10/A11/A12                   Hard Disk Degumming: PCIE NAND                   Fingerprint repair: 6/6P/6S/6SP/7/7P/8/8PDiameter: 94 mmThickness: 4mmCan be works with MC75T microscope. Package Included: 1 x MECHANIC..

Features :   Japan imported steel sheet materials, high temperature resistant, difficult to deformation, heat sink anti drum design It's ideal for BGA153/BGA162/BGA169/BGA186/BGA221/BGA254 EMCP EMMC. Package includeds : 1 x Steel Net  Details pictures :..

Specification:High temperature resistance.A variety of screws to prevent loss.Independent magnetic division.Soft silicone, full of elasticity.Increase thickness.Antistatic, large working area.   Pakcage Included:1 x BEST S160 Magnetic Heat Insulation Silicone P..

Features: Imported 0.12mm square-hole steel mesh. High temperature resistance. Anti deformation. Toughness. Type: for iPHone 6S/6SP / for iPHone 7/7P / iPHone 8/8P/X Package included: 1 x BGA Reballing Stencil Plant Tin Steel Net  ..

Description:  Brand new and high quality heat insulation pad.Resistance to high temperature of 500 °C.Sevaral hole location to set screws,IC chips and small parts.Built-in scale ruler (0 ~ 20 cm ).Make your repair work easy.A good partner for hot air g un.Th..

Features: Imported 0.12mm square-hole steel mesh. High temperature resistance. Anti deformation. Toughness. Type: for iPHone 6S/6SP / for iPHone 7/7P / iPHone 8/8P/X Package included: 1 x BGA Reballing Stencil Plant Tin Steel Net Details pictures:..

Features:Applicable: 5 CPU models: A8/A9/A10/A11/A12                   Hard Disk Degumming: PCIE NAND                   Fingerprint repair: 6/6P/6S/6SP/7/7P/8/8PDiameter: 94 mmThickness: 4mmCan be works with MC75T microscope. Package Included: 1 x MECHANIC MC08S Stereo Micr..

Features:Function: Reballing IC pins. Suitable for iPhone 6/6P 7/7P 8/8P XS.Package Included:1 x Tin Planting Net for iPhone 6/6P 7/7P 8/8P XSDetail Picures:..

Description:  Corner Sidewall Bender Frame Repair Tool Kit Set For Iphone 6P/5/5s Ipad 2/3/4  Features:  *This useful tool kit will help user to fix repair straighten the damages / dents / bents at corners and sidewalls of the mid frame housing..

Features:First put the iPhone X motherboard into the tin planting platform.Then put the tin-planting steel mesh of the middle motherboard of the iPhone X into the tin-planting platform.Package Included: 1 x Tin Plant Platform Detail Pictures:..