Precise BGA Rework Tools

Description:15 in 1 Guide Magnetic Screw Keeper Memory Chart Mat Figure Positioning Pad Repair Tool for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XRR/11/11 PRO/11 PRO MAXSpecification:Quantity: 15 Sheets/SetProduct Size: 177 X 160 X 6mm/6.97 X 6.3 X 0.24"Compatible Models: for iPhone 6 / 6P / 6S / 6S..

Features:   Professional repair tool set for iPhone CPU disassemble For BGA repair,dismantling phone CPU chip and phone repair It can be used to separate the welding spot One handle and 8 pcs blades in different shape The ultra thin blade is made o..

Features:Function: Reballing IC pins. Suitable for iPhone 6/6P 7/7P 8/8P XS.Package Included:1 x Tin Planting Net for iPhone 6/6P 7/7P 8/8P XSDetail Picures:..

Features:Applicable: 5 CPU models: A8/A9/A10/A11/A12                   Hard Disk Degumming: PCIE NAND                   Fingerprint repair: 6/6P/6S/6SP/7/7P/8/8PDiameter: 94 mmThickness: 4mmCan be works with MC75T microscope. Package Included: 1 x MECHANIC..

Features :   Japan imported steel sheet materials, high temperature resistant, difficult to deformation, heat sink anti drum design It's ideal for BGA153/BGA162/BGA169/BGA186/BGA221/BGA254 EMCP EMMC. Package includeds : 1 x Steel Net  Details pictures :..

Specification:High temperature resistance.A variety of screws to prevent loss.Independent magnetic division.Soft silicone, full of elasticity.Increase thickness.Antistatic, large working area.   Pakcage Included:1 x BEST S160 Magnetic Heat Insulation Silicone P..

Features: Imported 0.12mm square-hole steel mesh. High temperature resistance. Anti deformation. Toughness. Type: for iPHone 6S/6SP / for iPHone 7/7P / iPHone 8/8P/X Package included: 1 x BGA Reballing Stencil Plant Tin Steel Net  ..

Description:  Brand new and high quality heat insulation pad.Resistance to high temperature of 500 °C.Sevaral hole location to set screws,IC chips and small parts.Built-in scale ruler (0 ~ 20 cm ).Make your repair work easy.A good partner for hot air g un.Th..

Features: Imported 0.12mm square-hole steel mesh. High temperature resistance. Anti deformation. Toughness. Type: for iPHone 6S/6SP / for iPHone 7/7P / iPHone 8/8P/X Package included: 1 x BGA Reballing Stencil Plant Tin Steel Net Details pictures:..

Features:   Professional repair tool set for iPhone CPU disassemble For BGA repair,dismantling phone CPU chip and phone repair It can be used to separate the welding spot One handle and 8 pcs blades in different shape The ultra thin blade is made o..

Features:Applicable: 5 CPU models: A8/A9/A10/A11/A12                   Hard Disk Degumming: PCIE NAND                   Fingerprint repair: 6/6P/6S/6SP/7/7P/8/8PDiameter: 94 mmThickness: 4mmCan be works with MC75T microscope. Package Included: 1 x MECHANIC MC08S Stereo Micr..

Features: JF-870 series special magnetic pad for iPhone simplifies your disassembly process, accurately locates the screw hole position with color guide points, and brings magnetic adsorption screw and spare parts to make it not easy to lose. Lightweight and portable, complete models. Size: 1..